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TS982
Wide bandwidth dual bipolar operational amplifier
Features

Operating from VCC = 2.5 V to 5.5 V 200 mA output current on each amplifier High dissipation package Rail-to-rail input and output Unity-gain stable DW SO-8 exposed-pad (Plastic micropackage)
Applications

Hall sensor compensation coil Servo amplifier Motor driver Industrial Automotive
Pin connections (top view)
Output1 1 Inverting Input1 2 Non Inverting Input1 3 VCC - 4
8 VCC +
+
7 Output2
+
6 Inverting Input2 5 Non Inverting Input2
Description
The TS982 is a dual operational amplifier able to drive 200 mA down to voltages as low as 2.7 V. The SO-8 exposed-pad package allows high current output at high ambient temperatures making it a reliable solution for automotive and industrial applications. The TS982 is stable with a unity gain.
Cross Section View Showing Exposed-Pad This pad can be connected to a (-Vcc) copper area on the PCB
June 2008
Rev 6
1/20
www.st.com 20
Contents
TS982
Contents
1 2 3 Absolute maximum ratings and operating conditions . . . . . . . . . . . . . 3 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Application information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
3.1 3.2 3.3 3.4 3.5 Exposed-pad package description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Exposed-pad electrical connection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Thermal management benefits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Thermal management guidelines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Parallel operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
4 5 6
Package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Ordering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
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TS982
Absolute maximum ratings and operating conditions
1
Absolute maximum ratings and operating conditions
Table 1.
Symbol VCC Vin Toper Tstg Tj Rthja Rthjc Supply voltage(1) Input voltage Operating free-air temperature range Storage temperature Maximum junction temperature Thermal resistance junction to ambient(2)
Absolute maximum ratings (AMR)
Parameter Value 6 -0.3 V to VCC +0.3 V -40 to + 125 -65 to +150 150 45 10 2
(4)
Unit V V C C C C/W C/W kV kV V mA C
(6)
Thermal resistance junction to case Human body model (HBM)l(3)
ESD
Charged device model (CDM) Machine model (MM)(5)
1.5 200 200 250 see note
Latch-up
Latch-up immunity (all pins) Lead temperature (soldering, 10sec) Output short-circuit duration
1. All voltage values are measured with respect to the ground pin. 2. With two sides, two-plane PCB following the EIA/JEDEC JESD51-7 standard. 3. Human body model: A 100 pF capacitor is charged to the specified voltage, then discharged through a 1.5 k resistor between two pins of the device. This is done for all couples of connected pin combinations while the other pins are floating. 4. Charged device model: all pins and the package are charged together to the specified voltage and then discharged directly to the ground through only one pin. This is done for all pins. 5. Machine model: A 200 pF capacitor is charged to the specified voltage, then discharged directly between two pins of the device with no external series resistor (internal resistor < 5 ). This is done for all couples of connected pin combinations while the other pins are floating. 6. Short-circuits can cause excessive heating. Destructive dissipation can result from a short-circuit on one or two amplifiers simultaneously.
Table 2.
Symbol VCC Vicm CL
Operating conditions
Parameter Supply voltage Common mode input voltage range Load capacitor RL < 100 RL > 100 Value 2.5 to 5.5 GND to VCC 400 100 Unit V V pF
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Electrical characteristics
TS982
2
Electrical characteristics
Table 3.
Symbol ICC VIO VIO IIB IIO
Electrical characteristics for VCC+ = +5 V, VCC- = 0 V, and Tamb = 25 C (unless otherwise specified)
Parameter Supply current - No input signal, no load Tmin < Top < Tmax Input offset voltage (Vicm = VCC/2) Tmin < Top < Tmax Input offset voltage drift Input bias current - Vicm = VCC/2 Tmin < Top < Tmax Input offset current Vicm = VCC/2 High level output voltage RL = 16 RL = 16, Tmin < Top < Tmax Iout = 200mA VCC= 4.75V, T = 125 C, Iout = 25mA Low level output voltage RL = 16 RL = 16, Tmin < Top < Tmax Iout = 200mA VCC = 4.75V, T = 125C, Iout = 25mA 4.2 4 4.3 0.55 1 0.45 95 1.35 2.2 80 95 0.45 0.7 56 18 17 100 V dB MHz dB dB V/s degrees dB
nV ----------Hz
Min.
Typ. 5.5 1 2 200
Max. 7.2 7.2 5 7
Unit mA mV V/C
500 500
nA nA
10
4.4 4
V
VOH
V 0.65 0.95
V
VOL
AVD GBP CMR SVR SR m Gm en Crosstalk
Large signal voltage gain RL = 16 Gain bandwidth product RL = 32 Common mode rejection ratio Supply voltage rejection ratio Slew rate, unity gain inverting RL = 16 Phase margin at unit gain , RL = 16 CL = 400pF Gain margin , RL = 16 CL = 400pF Equivalent input noise voltage F = 1kHz Channel separation , RL = 16 F = 1kHz
dB
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TS982 Table 4.
Symbol ICC VIO VIO IIB IIO
Electrical characteristics Electrical characteristics for VCC+ = +3.3 V, VCC- = 0 V, and Tamb = 25 C (unless otherwise specified)(1) Table 5. Parameter
Min. Typ. 5.3 1 2 200 500 500 Max. 7.2 7.2 5 7 Unit mA mV V/C nA nA
Supply current - No input signal, no load Tmin < Top < Tmax Input offset voltage (Vicm = VCC/2) Tmin < Top < Tmax Input offset voltage drift Input bias current - Vicm = VCC/2 Tmin < Top < Tmax Input offset current Vicm = VCC/2 High level output voltage RL = 16 RL = 16, Tmin < Top < Tmax Iout = 200 mA Low level output voltage RL = 16 RL = 16, Tmin < Top < Tmax Iout = 200mA Large signal voltage gain RL = 16 Gain bandwidth product RL = 32 Common mode rejection ratio Supply voltage rejection ratio Slew rate, unity gain inverting RL = 16 Phase margin at unit gain , RL = 16 CL = 400pF Gain margin , RL = 16 CL = 400pF Equivalent input noise voltage F = 1kHz Channel separation RL = 16, F = 1kHz 0.45 1.2 2.68 2.64
10
VOH
2.85 2.3 0.52 0.65
V
VOL
0.45 1 92 2 75 95 0.7 57 16 17 100
V
AVD GBP CMR SVR SR m Gm en Crosstalk
dB MHz dB dB V/s degrees dB
nV ----------Hz
dB
1. All electrical values are guaranteed by correlation with measurements at 2.7 V and 5 V.
5/20
Electrical characteristics Table 6.
Symbol ICC VIO VIO IIB IIO
TS982
Electrical characteristics for VCC = +2.7 V, VCC- = 0 V, and Tamb = 25 C (unless otherwise specified)
Parameter Supply current - No input signal, no load Tmin < Top < Tma Input offset voltage (Vicm = VCC/2) Tmin < Top < Tmax Input offset voltage drift Input bias current - Vicm = VCC/2 Tmin < Top < Tmax Input offset current Vicm = VCC/2 High level output voltage RL = 16 RL = 16, Tmin < Top < Tmax Iout = 20 mA Low level output voltage RL = 16 RL = 16, Tmin < Top < Tmax Iout = 200mA Large signal voltage gain RL = 16 Gain bandwidth product RL = 32 Common mode rejection ratio Supply voltage rejection ratio Slew rate, unity gain inverting RL = 16 Phase margin at unit gain , RL = 16 CL = 400pF Gain margin , RL = 16 CL = 400pF Equivalent input noise voltage F = 1kHz Channel separation RL = 16, F = 1kHz 0.45 1.2 2.3 2.25 Min. Typ. 5.3 1 2 200 500 500 Max. 6.4 6.4 5 7 Unit mA mV V/C nA nA
10
VOH
2.85 2.3 0.45 1 92 2 75 95 0.7 57 16 17 100 0.37 0.42
V
VOL
V
AVD GBP CMR SVR SR m Gm en Crosstalk
dB MHz dB dB V/s degrees dB
nV ----------Hz
dB
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TS982
Electrical characteristics
Figure 1.
Current consumption vs. supply voltage
Ta=125 C Ta=25 C Ta=-40 C
Figure 2.
Voltage drop vs. output sourcing current
No load
Vcc = 2.7V to 5V Vicm = Vcc/2 Vid = 100mV Output Sourcing Testboard PCB
Figure 3.
Voltage drop vs. output sinking current
Figure 4.
Voltage drop vs. supply voltage (sourcing)
Vcc = 2.7V to 5V Vicm = Vcc/2 Vid = 100mV Output Sinking Testboard PCB
Vicm = Vcc/2 Vid = 100mV Isource = 200mA Testboard
Figure 5.
Voltage drop vs. supply voltage (sinking)
Figure 6.
Voltage drop vs. temperature (Iout = 50 mA)
Vicm = Vcc/2 Vid = 100mV Isink = 200mA Testboard
Vcc = 5V Vicm = Vcc/2 Vid = 100mV Iout= 50mA
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Electrical characteristics
TS982
Figure 7.
Voltage drop vs. temperature (Iout = 100 mA)
Figure 8.
Voltage drop vs. temperature (Iout = 200 mA)
Vcc = 5V Vicm = Vcc/2 Vid = 100mV Iout= 100mA
Vcc = 5V Vicm = Vcc/2 Vid = 100mV Iout= 200mA
Figure 9.
Open loop gain and phase vs. frequency
180 Gain Vcc = 2.7V RL = 8 Tamb = 25C 160 140 120
Phase (Deg)
Figure 10. Open loop gain and phase vs. frequency
80 Gain 60 40
Gain (dB)
80 60 40
Gain (dB)
180 Vcc = 5V RL = 8 Tamb = 25C 160 140 120 100 Phase
Phase (Deg) Phase (Deg)
100 20 0 -20 -40 0.1 Phase 80 60 40 20 0 1 10 100 Frequency (kHz) 1000 10000 -20
20 0 -20 -40 0.1
80 60 40 20 0 1 10 100 Frequency (kHz) 1000 10000 -20
Figure 11. Open loop gain and phase vs. frequency
180 80 60
Gain (dB)
Figure 12. Open loop gain and phase vs. frequency
180 80 60
Phase (Deg) Gain (dB)
Gain
Vcc = 2.7V RL = 16 Tamb = 25C
160 140 120
Gain
Vcc = 5V RL = 16 Tamb = 25C
160 140 120
40 20 0 -20 -40 0.1 Phase
100 80 60 40 20 0 1 10 100 Frequency (kHz) 1000 10000 -20
40 20 0 -20 -40 0.1 Phase
100 80 60 40 20 0 1 10 100 Frequency (kHz) 1000 10000 -20
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TS982
Electrical characteristics
Figure 13. Open loop gain and phase vs. frequency
180 80 60
Gain (dB)
Figure 14. Open loop gain and phase vs. frequency
180 80 60
Phase (Deg) Gain (dB)
Gain
Vcc = 2.7V RL = 32 Tamb = 25C
160 140 120
Gain
Vcc = 5V RL = 32 Tamb = 25C
160 140 120 100
Phase (Deg) Phase (Deg) Phase (Deg)
40 20 0 -20 -40 0.1 Phase
100 80 60 40 20 0 1 10 100 Frequency (kHz) 1000 10000 -20
40 20 0 -20 -40 0.1 Phase
80 60 40 20 0 1 10 100 Frequency (kHz) 1000 10000 -20
Figure 15. Open loop gain and phase vs. frequency
180 80 60
Gain (dB)
Figure 16. Open loop gain and phase vs. frequency
180 80 60
Phase (Deg) Gain (dB)
Gain
Vcc = 2.7V RL = 600 Tamb = 25C
160 140 120
Gain
Vcc = 5V RL = 600 Tamb = 25C
160 140 120
40 20 0 -20 -40 0.1 Phase
100 80 60 40 20
40 20 0 -20 Phase
100 80 60 40 20 0
0 1 10 100 Frequency (kHz) 1000 10000 -20
-40 0.1
1
10 100 1000 Frequency (kHz)
10000
-20
Figure 17. Open loop gain and phase vs. frequency
180 80 60
Gain (dB)
Figure 18. Open loop gain and phase vs. frequency
180 80 60
Phase (Deg) Gain (dB)
Gain
Vcc = 2.7V RL = 5k Tamb = 25C
160 140 120
Gain
Vcc = 5V RL = 5k Tamb = 25C
160 140 120
40 20 0 -20 -40 0.1 Phase
100 80 60 40 20 0 1 10 100 Frequency (kHz) 1000 10000 -20
40 20 0 -20 -40 0.1 Phase
100 80 60 40 20 0 1 10 100 1000 Frequency (kHz) 10000 -20
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Electrical characteristics
TS982
Figure 19. Phase margin vs. supply voltage
50 RL=8 Tamb=25C 40
Phase Margin (Deg)
Figure 20. Gain margin vs. supply voltage
50 RL=8 Tamb=25C 40
30
Gain Margin (dB)
30
20
CL= 0 to 500pF
20
CL=0 to 500pF
10
10
0 2.0
2.5
3.0 3.5 4.0 Power Supply Voltage (V)
4.5
5.0
0 2.0
2.5
3.0 3.5 4.0 Power Supply Voltage (V)
4.5
5.0
Figure 21. Phase margin vs. supply voltage
50
Figure 22. Gain margin vs. supply voltage
50 RL=16 Tamb=25C
40
Phase Margin (Deg)
40
30
Gain Margin (dB)
CL= 0 to 500pF
30
20
20
CL=0 to 500pF
10 RL=16 Tamb=25C 0 2.0 2.5 3.0 3.5 4.0 Power Supply Voltage (V) 4.5 5.0
10
0 2.0
2.5
3.0 3.5 4.0 Power Supply Voltage (V)
4.5
5.0
Figure 23. Phase margin vs. supply voltage
50
Figure 24. Gain margin vs. supply voltage
50 RL=32 Tamb=25C
40
Phase Margin (Deg)
40 CL= 0 to 500pF
Gain Margin (dB)
30
30
20
20 CL=0 to 500pF 10
10 RL=32 Tamb=25C 0 2.0 2.5 3.0 3.5 4.0 Power Supply Voltage (V) 4.5 5.0
0 2.0
2.5
3.0 3.5 4.0 Power Supply Voltage (V)
4.5
5.0
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TS982
Electrical characteristics
Figure 25. Phase margin vs. supply voltage
70 60
Phase Margin (Deg)
Figure 26. Gain margin vs. supply voltage
20
CL=0pF CL=100pF CL=200pF
CL=0pF 40 30 20 10 RL=600 Tamb=25C 2.5
CL=500pF
Gain Margin (dB)
50
10
CL=500pF
RL=600 Tamb=25C 3.0 3.5 4.0 Power Supply Voltage (V) 4.5 5.0 0 2.0 2.5 3.0 3.5 4.0 Power Supply Voltage (V) 4.5 5.0
0 2.0
Figure 27. Phase margin vs. supply voltage
70 60
Phase Margin (Deg)
Figure 28. Gain margin vs. supply voltage
20
CL=0pF
Gain Margin (dB)
50 40 30 20 10 0 2.0 RL=5k Tamb=25C 2.5 3.0 3.5 4.0 Power Supply Voltage (V) 4.5 5.0 CL=0pF CL=300pF CL=500pF
CL=100pF
10
CL=200pF
CL=500pF
RL=5k Tamb=25C 0 2.0 2.5 3.0 3.5 4.0 Power Supply Voltage (V) 4.5 5.0
Figure 29. Distortion vs. output voltage
Figure 30. Distortion vs. output voltage
RL = 4 F = 1kHz Av = +1 BW < 80kHz Tamb = 25C
RL = 2 F = 1kHz Av = +1 BW < 80kHz Tamb = 25C
Vcc=2.7V
Vcc=5V
Vcc=2.7V
Vcc=5V
Vcc=3.3V
Vcc=3.3V
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Electrical characteristics
TS982
Figure 31. Distortion vs. output voltage
Figure 32. Distortion vs. output voltage
RL = 8 F = 1kHz Av = +1 BW < 80kHz Tamb = 25C
Vcc=2.7V
Vcc=5V
RL = 16 F = 1kHz Av = +1 BW < 80kHz Tamb = 25C
Vcc=2.7V
Vcc=5V
Vcc=3.3V
Vcc=3.3V
Figure 33. Crosstalk vs. frequency
100
Figure 34. Crosstalk vs. frequency
100
80
ChB to ChA ChA to ChB
Crosstalk (dB)
80
ChB to ChA ChA to ChB
Crosstalk (dB)
60 RL=8 Vcc=5V Pout=100mW Av=-1 Bw < 125kHz Tamb=25C 20 100 1000 Frequency (Hz) 10000 20k
60 RL=16 Vcc=5V Pout=90mW Av=-1 Bw < 125kHz Tamb=25C 20 100 1000 Frequency (Hz) 10000 20k
40
40
20
20
Figure 35. Crosstalk vs. frequency
100
Figure 36. Crosstalk vs. frequency
120 100
80
ChB to ChA & ChA to Chb
Crosstalk (dB)
60 RL=32 Vcc=5V Pout=60mW Av=-1 Bw < 125kHz Tamb=25C 20 100 1000 Frequency (Hz) 10000 20k
Crosstalk (dB)
80 60 40 20 0
ChB to ChA & ChA to Chb
40
20
RL=600 Vcc=5V Vout=1.4Vrms Av=-1 Bw < 125kHz Tamb=25C 20 100 1000 Frequency (Hz) 10000 20k
12/20
TS982
Electrical characteristics
Figure 37. Crosstalk vs. frequency
Figure 38. Equivalent input noise voltage vs. frequency
Equivalent Input Noise Voltage (nv/ Hz)
120 100 80 60 40 20 0 RL=5k Vcc=5V Vout=1.5Vrms Av=-1 Bw < 125kHz Tamb=25C 20 100 1000 Frequency (Hz) 10000 20k ChB to ChA & ChA to Chb
25 Vcc=5V Rs=100 Tamb=25C 20
Crosstalk (dB)
15
10
5 0.02
0.1
1 Frequency (kHz)
10
Figure 39. Power supply rejection ratio vs. frequency
Vcc=5V
Vcc=3.3V
Vcc=2.7V
Gain = +1 pins 3 & 5 tied to Vcc/2 RL >= 8 Vin=70mVrms Vripple on pin8=100mVpp Tamb=25C
20
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Application information
TS982
3
3.1
Application information
Exposed-pad package description
The dual operational amplifier TS982 is housed in an SO-8 exposed-pad plastic package. As shown in Figure 40, the die is mounted and glued on a lead frame. This lead frame is exposed as a thermal pad on the underside of the package. The thermal contact is direct with the die and therefore, offers an excellent thermal performance in comparison with the common SO packages. The thermal contact between the die and the exposed-pad is characterized using the parameter Rthjc. Figure 40. Exposed-pad plastic package
As 90% of the heat is removed through the pad, the thermal dissipation of the circuit is directly linked to the copper area soldered to the pad. In other words, the Rthja depends on the copper area and the number of layers of the printed circuit board under the pad. Figure 41. TS982 test board layout: 6 cm2 of copper topside
3.2
Exposed-pad electrical connection
In the SO-8 exposed-pad package, the silicon die is mounted on the thermal pad (see Figure 40). The silicon substrate is not directly connected to the pad because of the glue. Therefore, the copper area of the exposed-pad must be connected to the substrate voltage (VCC-) pin 4.
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TS982
Application information
3.3
Thermal management benefits
A good thermal design is important to maintain the temperature of the silicon junction below Tj = 150 C as given in the absolute maximum ratings and also to maintain the operating power level. Another effect of temperature is that the life expectancy of an integrated circuit decreases exponentially when operating at high temperature over an extended period of time. It is estimated that, the chip failure rate doubles for every 10 to 20 C. This demonstrates that reducing the junction temperature is also important to improve the reliability of the amplifier. Because of the high dissipation capability of the SO-8 exposed-pad package, the dual opamp TS982 has a lower junction temperature for high current applications in high ambient temperatures.
3.4
Thermal management guidelines
The following guidelines are a simple procedure to determine the PCB you should use in order to get the best from the SO-8 exposed-pad package: 1. Determine the total power Ptotal to be dissipated by the IC. Ptotal = ICC x VCC + Vdrop1 x Iout1+ Vdrop2 x Iout2 ICC x VCC is the DC power needed by the TS982 to operate with no load. Refer to Figure 1: Current consumption vs. supply voltage on page 7 to determine ICC versus VCC and versus temperature. The other terms are the power dissipated by the two operators to source the load. If the output signal can be assimilated to a DC signal, you can calculate the dissipated power using the voltage drop curves versus output current, supply voltage, and temperature (Figure 2 on page 7 to Figure 8 on page 8). 2. 3. Specify the maximum operating temperature, (Ta) of the TS982. Specify the maximum junction temperature (Tj) at the maximum output power. As discussed above, Tj must be below 150C and as low as possible for reliability considerations. Rthja = (Tj - Ta)/Ptotal Different PCBs can give the right Rthja for a given application. Figure 42 gives the Rthja of the SO-8 exposed pad versus the copper area of a top side PCB.
Therefore, the maximum thermal resistance between junction and ambient Rthja is:
15/20
Application information Figure 42. Rthja of the TS982 vs. top side copper area
TS982
The ultimate Rthja of the package on a 4-layer PCB under natural convection conditions, is 45 C/W by using two power planes and metallized holes.
3.5
Parallel operation
Using the two amplifiers of the TS982 in parallel mode provides a higher output current: 400 mA. Figure 43. Parallel operation: 400 mA output current
10K
10K Input
TS981-1
400 mA Output Current
+
Load
TS981-2
+
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TS982
Package information
4
Package information
In order to meet environmental requirements, STMicroelectronics offers these devices in ECOPACK(R) packages. These packages have a Lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an STMicroelectronics trademark. ECOPACK specifications are available at: www.st.com.
17/20
Package information Figure 44. SO-8 exposed pad package mechanical drawing
TS982
Table 7.
SO-8 exposed pad package mechanical data
Dimensions
Ref. Min. A A1 A2 B C D D1 E E1 e H h L k ddd 5.80 0.25 0.40 3.80 1.35 0.10 1.10 0.33 0.19 4.80
Millimeters Typ. Max. 1.75 0.15 1.65 0.51 0.25 5.00 3.1 4.00 2.41 1.27 6.20 0.50 1.27 0.228 0.010 0.016 8 (max.) 0.1 0.150 Min. 0.053 0.04 0.043 0.013 0.007 0.189
Inches Typ. Max. 0.069 0.059 0.065 0.020 0.010 0.197 0.122 0.157 0.095 0.050 0.244 0.020 0.050
0.04
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TS982
Ordering information
5
Ordering information
Table 8. Order codes
Temperature range Package SO-8 exposed-pad TS982IDWT TS982IYDW(1) TS982IYDWT(1) -40 C to +125 C SO-8 exposed-pad (Automotive grade) Tube TS982IY Tape & reel Tape & reel Packing Tube TS982I Marking
Order code TS982IDW
1. Qualified and characterized according to AEC Q100 and Q003 or equivalent, advanced screening according to AEC Q001 & Q 002 or equivalent.
6
Revision history
Table 9.
Date 02-Jan-2004 01-Feb- 2004 01-Dec-2005 02-Apr-2006
Document revision history
Revision 1 2 3 4 First release. Order codes modified on cover page. PPAP references inserted in the datasheet see Table 5: Ordering information on page 19. VOH and VOL limits (at VCC = 4.75 V, Tamb = 125 C) added in Table 3. on page 4. Corrections to Section 3.3: Thermal management benefits and Section 3.4: Thermal management guidelines on page 15. Pad size added to package mechanical data table under SO-8 exposed pad package mechanical drawing on page 18, and stand-off value corrected. Corrected value of VOH for VCC = 2.7 V. Moved ordering information from cover page to end of document. Added footnotes for ESD parameters in Table 1: Absolute maximum ratings (AMR). Added footnote for automotive grade parts in Table 8: Order codes. Changes
24-Oct-2006
5
5-Jun-2008
6
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TS982
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